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Packaging Summit 2010
The Packaging Summit 2010 is a high-level conference that delivers critical information to professionals across the packaging value chain. Its mission is to foster an environment of collaboration and innovation across disciplines through education and interaction. The Summit empowers attendees, who manage and influence how products are packaged, with critical information that helps them reduce packaging costs; improve efficiencies; explore sustainable strategies; and leverage packaging to add value to their brands. The Packaging Summit is structured to offer ample networking opportunities with your peers. The networking reception along with IoPP's AmeriStar Awards reception provide time to share ideas and network with other key packaging professionals-colleagues who can become resources to you in the future.
18-May-2010 to 19-Mar-2010
Location: Chicago, Illinois, USA
Organisers: Institute of Packaging Professionals
email: tom.s@issi-texas.com
URL:
http://www.innovativetechnologyconferences.com/files/public/ps.htm
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